Micro & nanostructures

• Excimer laser micromachining station (Optec  Light Shot v3)
  • Laser ablation of microstructures by mask projection technique
  • 193 nm laser source (ATL)
  • Vacuum cell for sample available
  • Maximum substrate size: 100x100 mm². Optical lateral resolution ~ 1.5 µm.
• Mask aligner (Suss MicroTec MA6):
  • Photolithography equipment for recording of micro structures in photoresist (transfer of mask pattern) 
  • Maximum substrate size: 150 x 150 mm². Lateral resolution < 1 µm.
• Direct Writing Laser (Heidelberg DWL 66)
  • Photolithography equipment for recording of micro structures in photoresist (freeform pattern created by the scanning of a laser beam)
  • Maximum substrate size: 140 x 140 mm². Lateral resolution ~0.6 µm.
• Two-photon polymerization system (Teem Photonics)
• Plasma etching facility
  • Transfer in hard materials of microstructures recorded in photoresist
  • RF 12 cm plasma beam source
• Soft UV and hot embossing stations

 Excimer laser micromachining system

Mask aligner system

Clean room dedicated to replication techniques