Coating facilities

Vacuum coating facilities (thin films)

• Ion Beam Sputtering (IBS) and magnetron sputtering facility
  • Material target is sputtered with a 10 cm gridded ion beam source. 3 targets can be installed to deposit up to 3 different materials in the same vacuum batch.
  • Material target is sputtered with a magnetron head (RF sputtering). 3 magnetron heads are available (~10 cm diameter) to deposit up to 3 different materials in the same vacuum batch.
• Thermal evaporation and electron beam facility
  • Thermal evaporator (resistance).
  • Electron beam (e-beam) evaporator.  The deposition is here assisted with a gridless ion beam source. 

Wet coating equipment (photoresist, sol-gel …)

• Spin coater (Suss Microtech)
• Dip coater (Bungard)

Magnetron sputtering facility