Surface Engineering : Services

COATING DEPOSITION

 

 DEPOSITION TECHNIQUES


Thermal evaporation
 E-beam evaporation
 Magnetron sputtering
 Ion beam sputtering

facilities

DEPOSITED MATERIALS

 

Metals,dielectrics

Conductive oxides
Semiconductors
 Dynamic materials

 

deposit

FUNCTIONS

 

Anti-reflection
Reflectors
Beam Splitters
Filters
Sensing
Micro-fabrication

 

custom coating

 

 

DESIGN

 

Optical stack simulation 
Optical performances computation 
Monitoring strategy


METROLOGY

 

Coating structure and thickness
Absorption, solar absorbance
Refractive indices
Reflectivity & Transmission

 

graphic

 

 

QUALIFICATION

 

Optimization and check of coating performances against severe environmental conditions:

humidity
thermal cycling
radiations      

 

APPLICATION FIELDS 

 

Aerospace
Defense 
Industry

R&D

 

 

 

ION BEAM FIGURING

 

SURFACE CORRECTION BY MATERIAL ABLATION (FIGURING)

 

ion beam 1 ion beam 2

 

Example on SiC mirror 90 mm

RMS=243 nm       RMS=13 nm
PV=1050 nm        PV=86 nm

 

 

SURFACE MODIFICATION BY MATERIAL ABLATION (TEXTURATION)

Modification of Surface roughness – impact on light scattering

 

surface modification 1  surface modification 2

 

 

 

NANOENGINEERING

 

PROCESS

       Laser generation of nanoparticles in liquids matrices 

      Spin, dip or spray coating on surfaces possible

      Self-standing films or foils possible

 

APPLICATION FIELDS

      Modification of optical, mechanical and thermal properties of materials 
      Radiation shielding
      Biomedicals
      Emissivity control
      Photovoltaïcs
      Catalytic solutions

 

 

 

METROLOGY

 

 metrology

Scanning Electron Microscope
Optical interferometer
Optical profilometer
Atomic force microscope

VIS/IR ellipsometer
Spectrophotometer

 

 

PHOTOLITHOGRAPHY


photolithography 1

 

CSL is operating a Direct Laser Writing (DLW) facility, which allows recording microstructures (periodic or not) with details ranging from a few millimeters down to 0.5 micrometer, onto 140 mm x 140 mm substrates.

CSL is also equipped with holographic benches to record high resolution and high quality diffraction gratings.

photolithography 2

Microstructured coatings (masks, reticles, ...) can also be obtained by combining photolithography with thin film deposition, thanks to CSL’s various coating equipments.

 

 

DRY ETCHING


dry etching 1

 

Reactive Plasma Beam Etching (RPBE) is used to transfer micro-structures into a monolithic substrate. The interest of such a technique comes particularly from its high selectivity, the potential to efficiently etch one material and not another one, used as a mask. RPBE is widely used in the fabrication of micro-optical elements such as diffraction grating, phase plates, inserts …

dry etching 2

CSL is also operating an excimer laser facility for direct ablation of various  materials, with details down to 2 micrometers.

 

 

MICRO-REPLICATION


mocro replication

CSL has developed several efficient techniques for high and middle volume replication of micro-structures.

Hot embossing uses electroplated metallic master of a photolithographically originated element to be applied as a mould onto polymer or low-Tg glass substrates for pattern transfer.

 

Soft UV-embossing allows replicating a micro-structured pattern into UV curable photopolymer coated on a rigid substrate (nanoimprint).

 

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Contact(s) : Karl Fleury kfleury@ulg.ac.be